PCB ASSEMBLY

 

Surface Mount Assembly

Interconics have used Samsung Surface mount technology for the last seven years, we recently upgraded to the six headed CP45 NEO with a placementcapability of 16,000 components per hour.

- Components handled down to 0201
- 120 tape feeders
- Facility for tube feed
- Full pick and place file generation
- Sixteen waffle tray feeders
- Potential for on board and individual component fiducial verification
- Every component measured and verified on the fly

 

 

Hand Assembly

For one off prototypes and very small volumes we can solder paste print and hand place smd components, we aslo hand solder for repair and rework applications. we are also evaluating the various robot and automatic soldering machines currently available ....watch this space for developments.

- Hand build for small prototypes
- through hole assembly
- Large common caps and resistor stock
- Very fast assembly cycle available
- Automatic Optical test

 

 

Kitting

We can build from Free issue components but also offer a competitive kitting service from our inhouse stocks and extensive component purchasing contacts we can also source obsolete and hard to find components through these contacts.

 

- Surface mount and through hole parts
- All Technologies
- Mid volume on fast turn round
- Competitive costs
- Full certification and Test if required.

 

 

Bga Testing and Repair

We have an ERSA BGA, micro BGA, and SMT repair station which employs new high power (up to 300 times enlargement) motor zoom camera controllable LED ring lighting system and a robust movable stand. The reflow process can be visualised from various angles on even the smallest of components . the process of removal and replacement of components is fully programmable and repeatable and the process can be captured and recorded for future analysis. The unit can also be used in pick and place mode with accurate and repeatable results (+/- 0.010 mm)

 

 

Automated Optical Inspection

INTERCONICS employ a GOPEL Automated Optical Inspection equipment for quality assurance in all assemblies. Founded on the traditions of the high-tech area of Jena/Germany, the technical specification and capabilities are based on innovative technologies.

- Flexible camera configuration
- High fault detection at minimum false call rate
- Outstanding image quality through telecentric lens
- Very simple test program generation due to manufacturing-oriented library structure