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Circuit Board Assembly


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X-Ray Inspection

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BGA Place/Test/Repair

   

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Through Hole

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Kitting

Surface Mount Specifications

Placement Rate(Tact Time)

Chip Max. Speed
0.178sec/chip
Chip IPC9850
14,900 CPH(1608)
QFP
0.4sec(*0.8 sec) / QFP100(Flying Vision)
1.6 sec / QFP256(Stage Vision)

Placement Accuracy

0603 Chip
+/- 0.08mm(3¥ò)
1005 Chip
+/- 0.1mm(3¥ò)
QFP
+/- 0.04mm(3¥ò)

Placement Range

Range
1005Chip
<22mm IC(Flying Vision),
<32mm IC(0.4P / 35mm Stage Vision)

QFP,BGA,CSP,Connector

Min Lead Pitch(BGA)
0.3mm (20mm Stage Vision)
Min Ball Pitch(BGA)
0.5mm (20mm Stage Vision)
Max Height
H 9mm(Flying Stage), H 15mm(Stage Vision)

Board Size

Board Size(mm)
460X400X4.2~50X30X0.38

 

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